Description
Intel is hiring an on-site Lithography Process Development Engineer in Hillsboro, Oregon, to develop and optimize photolithography processes for advanced semiconductor packaging and hybrid bonding applications. The role covers scanner/stepper and track qualification, photoresist and underlayer process development, overlay metrology and advanced process control, integrated process flows, defect and yield analysis, and technology roadmap work with equipment and material suppliers. Candidates need a relevant master's degree with at least three years of experience or a PhD with at least two years, plus hands-on semiconductor-fab lithography and photoresist development experience, optical lithography knowledge, and SPC/DOE proficiency.
