Description
Intel is hiring an on-site LYA Engineer in Hillsboro, Oregon, for a hybrid electrical-characterization and failure-analysis role supporting back-end package assembly and wafer-level assembly sort and test. The engineer will perform package design and sustaining support, hands-on laboratory testing, electrical fault isolation, defect and process characterization, data analysis, root-cause determination, and corrective-action recommendations while collaborating with engineering technicians, yield and integration teams, suppliers, and customers. The role requires a master's degree or higher in a relevant engineering or physical-science field, at least one year of prior laboratory experience, and experience with defect characterization or electrical fault-isolation techniques.
