Description
Applied Materials is hiring a full-time Advanced Packaging Process Engineer in Singapore to lead the development and scaling of next-generation advanced packaging technologies, including PVD, CVD, and ALD. The role covers process and technology roadmaps, hardware characterization, complex process-engineering issues, customer demonstrations, cross-functional collaboration, and market-share improvement. The position requires supervisory or management experience, semiconductor thin-film and advanced-packaging expertise, and offers 20% travel, relocation eligibility, and a work location at Science Park II, moving to Tampines from April 2027.
