Description
Renesas Electronics is hiring a Manager of Semiconductor IC Packaging Assembly Engineering to support sustaining engineering, manufacturing execution, yield improvement, quality, process change, and NPI-to-high-volume manufacturing ramping for advanced semiconductor packaging technologies. The role coordinates with Package Engineering, Product Engineering, Quality, Supply Chain, and global OSAT partners, and requires a bachelor’s degree, 12+ years of semiconductor manufacturing and packaging engineering experience, and 5+ years leading technical projects or mentoring engineers.
