Mechanical Design Engineer for semiconductor packaging architecture at Intel

Intel is hiring a proactive Mechanical Design Engineer to support semiconductor packaging architecture by designing mechanical components, tooling, and collateral such as tape and reel packaging, substrates, integrated heat spreaders, stiffeners, package assemblies, and process media trays. The role requires cross-functional collaboration with architecture, process, and assembly teams, strong problem-solving and communication skills, and the ability to manage multiple projects with minimal supervision. The position is based in Phoenix, Arizona, is on-site, offers a college grad job type, and is not eligible for Intel immigration sponsorship.