Description
Micron Technology is hiring a Mechanical Simulation Engineer to develop thermo-mechanical and multiphysics models for advanced semiconductor packaging technologies, including HBM, 2.5D, and 3D integration. The role covers static and fatigue analyses, material characterization, failure and reliability simulations, AI/ML-driven surrogate and reduced-order modeling, and automation of simulation workflows. The engineer will collaborate with cross-functional teams and support fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding.
