Description
The Memory Packaging Engineer will define, develop, and qualify next-generation memory packages for Apple products, guiding package roadmaps and collaborating with internal engineering and memory vendor teams. The role covers architecture evaluation, electrical, mechanical, and thermal integration, vendor design-of-experiments and failure analysis, package plans of record, materials development, and full product-lifecycle ownership. A bachelor's degree and at least 10 years of relevant industry experience are required; an MS or PhD and additional packaging, reliability, and high-speed memory design experience are preferred.
