Description
The Memory Packaging Engineer will define, develop, and qualify next-generation memory packages for Apple products, guiding package roadmaps and collaborating with internal engineering and memory vendor teams. The role covers package architecture, form factor, process, layout, stackup, bill of materials, electrical, mechanical, and thermal integration, vendor design-of-experiments and failure analysis, and downstream yield and reliability. A bachelor's degree in a relevant field is required; an MS or PhD and at least three years of industry experience in high-bandwidth, high-density memory package design and assembly process development are preferred.
