Description
Boeing is hiring a Microelectronic Packaging Technical Lead Project Engineer for its Secure Computing Solutions team to lead project coordination and management for processor packaging solutions, including 3D advanced packaging. The role coordinates cross-functional teams, manages trade studies and supplier selection, oversees risks and resources, monitors cost and schedule performance, and supports project integration. It is 100% onsite, requires U.S. citizenship and the ability to obtain a U.S. Secret Clearance and Special Program Access, and offers a summary pay range of $146,200 to $197,800. Applications were accepted until September 30, 2026.
