Module Development Engineer at 100 Intel Corporation

Compensation · Listed in posting

$133,800 – $188,890/yr

Location: Hillsboro, Oregon
Type: Full-time
Level: staff+
Posted: Sep 17, 2026

Description

Intel is hiring a Chemical Mechanical Planarization (CMP) Process Development Engineer for its Logic Technology Development organization in Hillsboro, Oregon. The role develops and sustains CMP and other semiconductor manufacturing processes, performs process integration and feasibility studies, optimizes equipment and materials, and supports future device architectures and manufacturing roadmaps. Candidates need a PhD in a relevant STEM field with hands-on experimental research, with semiconductor device physics, process integration, data analysis, and experimental characterization preferred. The position requires an on-site presence and offers an annual salary range of $133,800 to $188,890 USD.

Required Skills

CMP
Process integration
Equipment metrology
Design of experiments
Device characterization
Data analysis
SPC

Additional Information

Minimum Education: PhD in Electrical Engineering, Electrical Computer Engineering, Chemical Engineering, Material Science, Physics, Chemistry, Computer Science, or a Semiconductor-related STEM field, with a focus on hands-on experimental research.
Required Previous Experiences: Industry-relevant job experience, internship experience, schoolwork, classes, or research.
Preferred Qualifications: Statistics coursework, SPC or DOE principles, and engineering analysis tools
Experimental laboratory work
Semiconductor and transistor device physics
Advanced transistor device structures and architectures, including fabrication and process integration
Data analysis and data-based problem-solving
Semiconductor processing fundamentals
Design of experiments
Materials and physical device characterization and semiconductor device testing
Statistical and data analysis using MATLAB, Excel, JMP, or similar tools
Translation Company Name: 100 Intel Corporation