Module Engineering PhD Intern 2027 at Intel

Compensation · Listed in posting

$120,898 – $120,902/yr

Location: Hillsboro, Oregon
Type: Full-time, Internship
Level: intern
Posted: Sep 9, 2026

Description

Intel is hiring a Module Engineering Intern for its F25 Metals organization to support high-volume manufacturing of leading-edge semiconductor technologies. The intern will lead a project involving process improvement, manufacturing efficiency, equipment performance, automation, data analytics, quality systems, or operational excellence, while participating in day-to-day engineering activities and collaborating with cross-functional stakeholders. The role requires an on-site presence in Hillsboro, Oregon, a minimum 10- to 12-week summer internship, and relevant academic or research experience. Compensation is listed at $120,898.00-120,902.00 USD annually.

Required Skills

Process improvement
Data analytics
Automation
Quality systems
Python
JMP
MATLAB
Power BI
SQL
Root cause analysis
8D
SPC
Pareto analysis
Design of Experiments
Lean
Six Sigma

Additional Information

Minimum Education: Currently pursuing a PhD in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or a related technical discipline
Required Previous Experiences: At least 3 months of educational, research, laboratory, internship, or industry experience
Preferred Qualifications: Previous internship, research, laboratory, project, or industry experience in engineering, manufacturing, data analytics, process development, or a related technical field
Familiarity with semiconductor manufacturing, industrial operations, quality systems, continuous improvement, or complex technical environments
Experience with data analysis and visualization tools such as Python, JMP, MATLAB, Power BI, Excel, or SQL
Knowledge of problem-solving and continuous improvement methodologies such as root cause analysis, 8D, SPC, Pareto analysis, DOE, Lean, or Six Sigma
Ability to analyze data, identify trends, and develop data-driven recommendations
Experience breaking down complex problems into executable plans and managing multiple priorities
Experience collaborating on cross-functional projects involving technical and non-technical stakeholders
Strong written, verbal, and presentation skills, including communicating technical concepts to diverse audiences
Self-motivated ability to learn quickly, ask questions, and take initiative
Experience creating technical documentation, reports, dashboards, presentations, posters, or project summaries
Exposure to semiconductor manufacturing, process engineering, automation, data analytics, equipment engineering, quality systems, manufacturing operations, materials science, or device fabrication
Translation Company Name: 100 Intel Corporation