Module Packaging Media Engineer at Intel

Compensation

$99,030 – $162,500/yr

Location: Hillsboro, Oregon
Type: Full-time
Level: not_specified

Description

Module Packaging Media Engineers are responsible for managing projects, designing/media developing, and providing ongoing support for integrated circuits, semiconductors, and other electronic components. Key duties involve thermal/mechanical/electrical design, defining package performance, conducting material testing, establishing material specifications, consulting on packaging issues, responding to client needs, and solving problems using engineering judgment.

Required Skills

Thermal Mechanical Electrical Design
Package Performance Specification
Qualification Plans Data Collection
Material Testing Research
Material Specifications
Packaging Problem Consultation
Client Request Response
Problem Solving Using Education and Judgment
Mechanical Design
CAD SolidWorks Driveworks RSS Analysis Geometric Dimensioning Finite Element Analysis
Full Cycle Project Management Experience
High Speed Pick-N-Place Motion Control Vision Systems
Novel Design Solutions High Volume Manufacturing Process
Stakeholder Management Supplier Project Management Internal Partner Management
Semiconductor Devices Packaging Processes Technology
Statistical Design Of Experiments Problem-Solving Techniques
Media Design Experience
Equipment Collateral Experience

Additional Information

Minimum Education: Bachelor's degree in mechanical engineering or related STEM field, or Master's degree in the same fields.
Required Previous Experiences: 4+ years of experience
2+ year of experience
Mechanical Design, CAD/Solidworks/Driveworks/RSS analysis/Geometric Dimensioning/Finite Eliminate Analysis experience.
Full cycle project management experience.
Preferred Qualifications: 3+ years of experience with Material Handling Systems (high-speed/accuracy pick-n-place, motion control, and vision systems).
Fundamental Science and Engineering Concepts for Novel Design Solutions in High Volume Manufacturing.
Stakeholder Management (suppliers/project managers/internal partners).
Semiconductor Devices and Packaging Processes and Technology.
Technical and Analytical Skills, Statistical Design of Experiments Knowledge, and Problem-Solving Techniques.
Media Design Experience.
Equipment Collateral Experience.