Description
GlobalFoundries Singapore is hiring an experienced Member of Technical Staff/Principal Process Engineer for its 300mm Advance Packaging Center. The role focuses on developing, optimizing, qualifying, and sustaining advanced packaging etch processes for multi-stack bond wafer and die-to-wafer applications, including troubleshooting, tool startup, process robustness, yield and reliability support, statistical and Six Sigma improvement, and process capability optimization. The position requires a relevant engineering degree and extensive advanced-packaging experience, with experience leading fab-wide cross-module process development and hands-on work with advanced packaging process tools.
