Description
Micron Technology is hiring a Process Integration Engineer for Advanced Packaging to develop and integrate advanced package architectures such as 2.5D, 3D stacking, HBM, and hybrid bonding. The role involves designing experiments, qualifying materials and processes, analyzing yield and performance data, supporting technology transfer and manufacturing readiness, and addressing wafer and die warpage. Candidates need a bachelor’s degree in materials, chemical, or a related engineering field plus at least eight years of advanced packaging experience, including TSV, bonding, interconnect, HBM, and cross-functional development experience.
