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New College Grad - Process Integration Engineer, APTD at Micron

Department: HIG

Setup
On-site
Location
Boise, Idaho
Level
not_specified
Posted

Description

Micron Technology is hiring a Process Integration Engineer in Advanced Packaging Technology Development to develop, characterize, and integrate packaging and interconnect solutions for next-generation semiconductor products. The role supports process development, technology evaluation, qualification, data analysis, and technical decision-making in a collaborative R&D environment, with an emphasis on AI-enabled tools and semiconductor manufacturing technologies.

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