Description
The role supports the development and validation of new die attach process bricks for semiconductor manufacturing by setting up and operating epoxy or solder die attach machines, creating recipes for LGA, BGA, QFN, and flip-chip packages, monitoring and troubleshooting process issues, ensuring quality compliance, and supporting DOE activities. It requires an associate degree or technical/vocational diploma in electronics, mechanical engineering, or a related field, 1–3 years of die attach process experience, familiarity with semiconductor manufacturing equipment, and willingness to work rotating shifts.
