Description
The NPI Leadframe / Die Attach Manager leads new product introduction, process development, material qualification, process transfer, and manufacturing stability for leadframe, substrate, and die attach technologies. The role coordinates with R&D, manufacturing, quality, supply chain, and equipment vendors; manages engineering changes, qualification plans, reliability validation, risk assessments, and continuous improvement; and supports yield, reliability, throughput, and cost optimization. It requires a degree in a relevant engineering or science discipline, at least 10 years of semiconductor assembly experience, and expertise in process characterization, DOE, JMP, SPC, vendor assessment, and PFAS-free material qualification.
