Description
Micron Technology is hiring a full-time Package Architecture Engineer to independently build, model, and simulate advanced package concepts for future memory systems. The role focuses on early-phase package exploration, trade-off studies across signal integrity, power integrity, thermals, cost, and scalability, hands-on package design and simulation, and translating results into architectural direction. Candidates need a bachelor’s degree or equivalent practical experience in a relevant technical field and at least 10 years of hands-on package design or package-level simulation experience; the US base salary range is $177,000 to $387,000 per year.
