Description
Renesas is hiring a Director of Semiconductor IC Packaging Assembly Engineering to lead sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies, including power packaging, wide-bandgap devices, and advanced interconnects. The role oversees yield, quality, process control, change management, NPI-to-HVM ramp execution, and global OSAT partner relationships while building and developing a global assembly engineering team. Candidates need a bachelor’s degree in a relevant engineering discipline, at least 12 years of semiconductor manufacturing and packaging engineering experience, and at least 5 years of leadership experience.
