Description
SiTime is hiring a Packaging Process Engineer in Thailand to develop, optimize, and sustain advanced semiconductor packaging processes for QFN and LGA technologies, including wafer thinning, dicing, and flip-chip bonding. The role covers process capability and statistical process control, root-cause analysis, process transfer, NPI, material and equipment qualification, and manufacturing support. It requires a bachelor's degree or higher in a relevant engineering or materials science discipline, at least five years of semiconductor packaging experience, statistical analysis and failure-analysis expertise, and English fluency. The position is 60% onsite in Bangkok or Ayutthaya with 10% travel across Asia and the United States.
