Description
Micron is hiring a Package Pathfinding Architect to define long-term packaging technology and system architectures for next-generation memory systems spanning datacenter and edge-AI applications. The role leads cross-stack co-optimization across silicon, package, board, and system areas; guides packaging strategy and industry standards; partners with customers and engineering teams; and develops AI-based EDA and measurement automation tools. Candidates need a master’s degree or equivalent, at least five years of relevant experience, extensive memory-package design experience, and familiarity with EDA, signal and power integrity, and AI/LLM engineering efficiency.
