Description
The Semiconductor Packaging Process Development Lead will lead R&D initiatives for die preparation and packaging processes, including laser groove/ablation, mechanical dicing, and stealth dicing. The role involves cross-functional collaboration, experimental design, data analysis, process optimization, documentation, problem resolution, technical leadership, and mentorship. Candidates need a bachelor's or master's degree in a relevant engineering or materials science field and at least 8 years of experience in semiconductor package assembly process development.
