Description
Micron Technology is hiring a GQ Package Reliability Engineer to coordinate package qualification for new products and innovative builds, develop reliability test plans, support product-launch recommendations, manage root-cause analysis and corrective actions for qualification failures and RMAs, prepare detailed reports, and assist internal and external customers with package-related quality and reliability matters. The role requires semiconductor packaging, reliability testing, failure analysis, and analytical problem-solving expertise, with a minimum of a BS degree, M.Sc., or comparable engineering experience; candidates with less than two years of experience are welcome to apply.
