Description
The IC Packaging Assembly Engineer will own the development, optimization, and sustainment of advanced flip-chip BGA assembly processes from pathfinding and NPI through high-volume manufacturing. The role leads packaging assembly technology development, supports SoC package development, collaborates with foundries and OSATs, defines assembly processes and design rules, conducts yield and reliability improvements, performs root-cause analysis, and interfaces with suppliers on materials and technologies. The position requires at least five years of semiconductor packaging experience, knowledge of FCBGA and related packaging technologies, strong engineering problem-solving and program-management skills, and an M.S. or Ph.D. in a relevant field is desired.
