Description
Microsoft Quantum is hiring a Packaging Engineer focused on mechanical simulation to adapt packaging processes and materials for quantum devices. The role performs thermal, structural, and thermo-mechanical simulations across substrates, interposers, chip attach, cryogenic components, and supporting structures; develops hand calculations, reduced-order models, and full finite-element analyses; assesses packaging reliability; and maintains reusable simulation workflows. Candidates need a relevant engineering degree and 3–5+ years of technical engineering experience, with cryogenic hardware, FEA, advanced packaging, and simulation-correlation experience preferred. The role offers a base pay range of USD 119,800–234,700 per year in the United States, with higher ranges in the San Francisco Bay area and New York City metropolitan area.
