Description
Texas Instruments is hiring a Packaging Engineering Intern to interface across work areas and organizations and support the design, development, and analysis of semiconductor packaging technologies for analog and embedded processing products. The intern may join cross-functional teams developing internal and external solutions for wirebond, flip chip, modules, SIPs, and other advanced packages, while also working on material, mechanical, thermal, and electrical characterization. The role requires a bachelor's degree in a relevant engineering or science field and a cumulative GPA of 3.0 or higher; semiconductor packaging knowledge, analytical and problem-solving skills, communication, teamwork, time management, relationship-building, adaptability, initiative, and results orientation are preferred. Visa sponsorship is not available.
