Description
fab2 is hiring Semiconductor Packaging Engineering Interns for a summer internship beginning in May or June, with a preferred 4–8 month commitment. The role involves hands-on research and development of semiconductor packaging technologies, including mechanical prototyping, system integration, experiment design, data analysis, and processes such as 3D printing, metal plating, lithography, and metrology. Applicants must be pursuing a bachelor’s degree or higher in engineering, have 1–2 hands-on wet-lab or lab-adjacent experiences, and demonstrate strong mechanical engineering and prototyping skills. The internship is paid hourly at an annualized range of $108,000–$126,000 depending on experience and education, with housing, benefits, paid time off, and visa sponsorship.
