Description
fab2 is hiring Semiconductor Packaging Engineering Interns for its winter term, beginning in January with a preferred 4–8 month commitment. The role is hands-on research and development in semiconductor packaging, involving mechanical prototyping, system integration, process improvement, and package or wafer processing. Interns will work with tools such as 3D printing, metal plating, lasering, and metrology, and must pursue a bachelor’s degree or higher in engineering, have 1–2 hands-on wet-lab or lab-adjacent experiences, and demonstrate strong mechanical engineering and prototyping skills. The internship is paid hourly at an annualized range of $108,000–$126,000 depending on experience and education, with housing, benefits, paid time off, and visa sponsorship.
