Description
GlobalFoundries is hiring a Packaging Engineer for its Integrated Optics organization to lead the development and sustainment of advanced optical packaging solutions for silicon photonics and co-packaged optics platforms. The role covers optical packaging architecture, fiber-to-chip coupling, heterogeneous integration, multiphysics simulation, yield and reliability analysis, production readiness, cost modeling, and cross-functional collaboration with OSATs and manufacturing teams. Candidates need a master’s degree or higher in a relevant engineering or materials science field and at least 8 years of semiconductor packaging experience focused on photonic or advanced packaging. The expected salary range is $143,000 to $247,000, with up to 25% travel to GlobalFoundries facilities or external partner sites.
