Packaging Module Development Engineer at 100 Intel Corporation

Compensation · Listed in posting

$133,800 – $255,200/yr

Location: Phoenix, Arizona
Type: Full-time
Level: mid
Posted: Sep 29, 2026

Description

Intel is hiring a Packaging Module Development Engineer specializing in laser and optical processing for its Substrate Packaging Technology Development organization. The role develops and optimizes laser, optical, and advanced packaging processes; designs experiments and analyzes data; supports equipment installation, qualification, and ramp; investigates process and equipment issues; and collaborates with engineering teams to improve semiconductor product performance, reliability, and manufacturability. The position is an experienced hire requiring a relevant STEM degree and hands-on experience with laser or optical processing technologies, and it requires an on-site presence in the Phoenix, Arizona area.

Required Skills

Laser processing
Optical processing
Python
MATLAB
JMP/JSL
LabVIEW
DOE
Statistical analysis
Root-cause analysis
Optical profiling
Surface metrology

Additional Information

Minimum Education: Ph.D. in Optical Engineering, Optics, Photonics, Physics, Applied Physics, Electrical Engineering, Materials Science, Mechanical Engineering, or a related STEM field; alternatively, a Master's degree in one of these STEM disciplines with 1+ years of relevant experience, or a Bachelor's degree with 3+ years of relevant industry experience.
Required Previous Experiences: Hands-on experience with laser, optical, photonic, or related advanced processing technologies in a laboratory, manufacturing, or development environment.
Proficiency in programming or scripting tools such as Python, MATLAB, JMP/JSL, C++, or LabVIEW for data analysis, process development, automation, or equipment control.
Experience applying experimental methods, statistical analysis, and data-driven problem-solving to technical challenges.
Strong analytical, troubleshooting, and communication skills with attention to detail and a structured approach to process development.
Preferred Qualifications: 4+ years of experience developing laser, optical, or precision micromachining processes for semiconductor, microelectronics, advanced materials, or related applications.
Understanding of laser-material interactions, including ultrafast pulse dynamics, nonlinear optical absorption, thermal and athermal ablation regimes, or laser-assisted surface finishing.
Experience with JMP Scripting Language or custom scripting for automated reporting, coordinate translation, toolpath generation, or recipe automation.
Hands-on operation of 3D optical profilers, confocal microscopes, or surface metrology tools to evaluate micro-features, step heights, and surface roughness.
Familiarity with optical modeling tools or multi-physics simulation software such as COMSOL or ANSYS for thermal or optical-mechanical modeling.