Packaging Module Development Engineer at Intel

Location: Kulim, Kedah
Type: Full-time
Level: mid
Posted: Oct 7, 2026

Description

Intel is hiring a Packaging Module Development Engineer in Kulim, Malaysia, to develop and validate SMT process solutions for IC packages and sockets, optimize reflow, stencil, solder paste, dispensing, and inspection processes, characterize materials, analyze assembly defects, integrate processes into manufacturing lines, support technology roadmaps, test prototypes, analyze process data, and train technicians. The role requires a bachelor's, master's, or Ph.D. degree in a relevant STEM field, at least three years of experience with a bachelor's or master's degree or two years with a Ph.D., and experience in semiconductor IC or PCB assembly, reflow, pick-and-place, dispensing, or related materials. The position is an experienced hire requiring on-site work during Shift 1.

Required Skills

SMT processes
Reflow profiling
Materials characterization
Failure analysis
SPC and DOE
Statistical analysis

Additional Information

Minimum Education: Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or a related STEM field; alternatively, a master's degree with 3+ years of experience or a Ph.D. with 2+ years of experience.
Required Previous Experiences: At least 3 years of experience with a bachelor's or master's degree.
At least 2 years of experience with a Ph.D. degree.
Experience in semiconductor IC assembly or printed circuit board assembly, including reflow, pick-and-place, dispensing, or related materials.
Preferred Qualifications: Proficiency in statistical tools and methods such as SPC and DOE for process optimization.
Strong written and verbal communication and cross-functional collaboration skills.
Proactive problem-solving and ability to work under tight timelines.