Description
Intel is hiring a Packaging Module Development Engineer to develop and optimize assembly processes and equipment for next-generation semiconductor packaging solutions. The role focuses on manufacturing efficiency, product reliability, equipment health, qualification, continuous improvement, and integration of new materials and architectures. It requires a relevant STEM degree and 1–2 years of experience depending on the degree, proficiency in statistical process control and design of experiments, and US citizenship. The position is based in Phoenix, Arizona, requires an on-site presence, and offers an annual salary range of $99,030 to $188,890 USD.
