Description
The Packaging Simulation Engineer will perform stress and deformation simulations of integrated-circuit packages to understand chip-package and package-board interactions and support device yield and reliability. The role also involves scripting CAD/FEM software and using generative-AI, machine-learning, and numerical tools to create automated model-generation interfaces. A bachelor's degree is required, while experience with major FEM tools, numerical simulation software, MATLAB or Scientific Python, generative-AI and machine learning, packaging materials, electronic packaging processes, and independent research is preferred.
