Description
Microsoft is hiring a Physical Design Engineer to join its semiconductor design team and perform physical design implementation and integration across block, subsystem, sub-chip, and full-chip levels. The role covers floorplanning, synthesis, placement, clocking, routing, static timing, physical verification, formal equivalency, power efficiency, IR-drop, and EM, with possible involvement in flow development and technology, IP, and vendor evaluation. The engineer will work with limited direction, provide progress and risk updates, and may travel occasionally. The position requires a bachelor's or master's degree in electrical or computer engineering or a related field, at least six years of experience, physical design signoff experience, and complex ASIC tapeout experience in leading-edge technology.
