Description
Astera Labs is hiring a Principal Advanced Packaging Engineer to lead R&D for next-generation optical-chip packaging technologies, including 2.1D, 2.5D, and 3D integration, EIC-to-PIC integration, packaging process flows, materials qualification, yield and reliability improvement, and PDK development. The role requires a degree in a relevant engineering or materials science field, at least 8 years of semiconductor or advanced packaging engineering experience, and expertise in advanced packaging processes, silicon photonics, OSAT qualification, and packaging design rules. The salary range is $205,000 to $260,000, with possible discretionary bonuses, incentives, and benefits.
