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Principal Application Engineer – semiconductor packaging at Intermedia Group

Compensation · Listed in posting

$130,000 – $155,000/yr

Location
Irvine, California
Type
Full-time
Level
lead/mgmt
Posted

Description

The Principal Application Engineer will support the client’s Adhesive Technologies business unit by developing KPI-driven innovation, applying semiconductor packaging knowledge to advanced packaging technologies such as 2.5D, HBM, and CoWoS, conducting material testing and test vehicle development, and serving as the primary technical interface for leading-edge clients. The role also manages a small 2-4 person Application Engineering team and coordinates with sales, marketing, product development, and other business units. The position is based in Irvine, California, offers relocation assistance, and requires a bachelor’s degree in a relevant engineering or materials science field plus 12 years of semiconductor packaging or process experience, including people management.

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