Principal ASIC Package Design Engineer at K2 Space

K2 is hiring a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a focus on flip-chip BGA and multi-chip module solutions. The role owns the end-to-end package strategy from early architecture and trade studies through vendor engagement, qualification, and production ramp, while defining standards, optimizing high-speed and power-dense packages, managing thermal and SI/PI architecture, and overseeing OSAT and substrate vendor relationships. The position requires a bachelor’s degree in a relevant engineering field and at least 10 years of ASIC package design experience, with a base salary of $200,000–$280,000 plus equity and comprehensive benefits.