Description
Micron is hiring a Principal Engineer for its Advanced Package Technology Development team at the Boise campus. The role focuses on developing differentiated semiconductor packaging technology, leading multi-disciplinary technical teams, shaping technology roadmaps, analyzing competitive trends, troubleshooting advanced issues, and contributing to patents, quality improvements, and cost reduction. Candidates need more than five years of semiconductor advanced packaging experience, a relevant advanced degree or equivalent experience, and expertise in high-bandwidth memory, 2.5D and 3D integration, hybrid bonding, wafer-level packaging, and DRAM manufacturing or OSAT companies.
