Description
Micron Technology is hiring a Principal Engineer for its Advanced Packaging Technology Development team at the Boise campus. The role leads advanced packaging technology roadmaps and investment priorities, drives differentiated technology solutions, collaborates with internal and external partners, influences senior technical and strategic decisions, analyzes competitive trends, and supports patents, trade secrets, presentations, and papers. Candidates need more than 10 years of semiconductor advanced packaging experience, a relevant advanced degree or equivalent experience, and expertise in high-bandwidth memory, 2.5D and 3D integration, hybrid bonding, wafer-level packaging, and DRAM manufacturing or OSAT companies.
