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Principal Engineer - Board/Package Co-design at ARM

Compensation

$249,900 – $338,100/yr

Setup
Hybrid
Location
Chandler, Arizona
Type
Full-time
Level
senior
Posted

Description

Arm is hiring an Electronics Engineer to specialize in PCB and silicon packaging co-design and system-level hardware architecture for embedded compute platforms. The role collaborates with SoC, packaging, and platform teams to define hardware requirements, evaluate trade-offs, support early silicon and board architecture, and develop PCB layouts and integration strategies. Required expertise includes high-speed interfaces, embedded board design, IC packaging, signal and power integrity, PCB fabrication, and EDA tools such as Cadence OrCAD and Allegro. The position offers a hybrid working arrangement and a salary range of $249,900-$338,100 per year.

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