Description
Micron is hiring a Principal Engineer / Member of Technical Staff focused on thin films for next-generation NAND process development. The role leads the creation and integration of dielectric, conductive, interface, and charge-storage thin films; explores materials, precursor chemistries, and deposition techniques; partners with device, process integration, and yield teams; leads technical task forces and engineers; and applies AI-enabled engineering tools to improve process development and R&D productivity. Candidates need hands-on expertise across CVD, LPCVD, PECVD, ALD, PEALD, and MOCVD processes, along with knowledge of thin-film reactors, materials, plasma physics, transport phenomena, or surface chemistry, and a demonstrated record of developing thin-film materials and deposition methods from concept through integration.
