Description
Infineon is hiring a Principal Engineer Package Technology to lead the definition, design, and development of semiconductor packaging solutions from concept through realization. The role serves as the technical expert and consultant for package design and assembly technologies, supports pre-development and project definition, drives innovation and technology scouting, and produces technical publications and patents. The position requires a bachelor’s degree in engineering, more than 10 years of experience in an IC or semiconductor environment, and expertise in semiconductor packaging, assembly, test, BE processes, materials, reliability, and quality requirements.
