Description
GlobalFoundries Singapore is hiring an experienced Diffusion Process Engineer for its 300mm Advance Packaging Center. The role develops and optimizes advanced packaging etch and diffusion processes, including bonding, debonding, plasma and UV cleaning, die reconstitution, annealing, and TSV; supports process and equipment startup, qualification, troubleshooting, SPC, yield improvement, and reliability; and coaches other engineers. The position requires a relevant BS, master's, or PhD degree and experience with bonder, die reconstitution, and annealing process tools.
