Description
Infineon is hiring a Principal Engineer, Unit Process Development to lead wire bond and semiconductor assembly process development, optimization, industrialization, and new product and package introductions. The role includes process parameter scouting and freeze, prototype and development sample support, technical handoffs to operations, supplier qualification, statistical and analytical problem solving, process documentation, and global technical leadership. Candidates should have a master's or bachelor's degree in engineering or a relevant course, at least 12 years of semiconductor manufacturing experience, preferably in wire bonding, and strong knowledge of assembly, material science, chemical engineering, analytical equipment, and statistical design of experiments.
