Description
Micron Technology is hiring a full-time onsite HBM Design Architecture Engineer to support the design and development of advanced HBM DRAM products. The role bridges internal design teams, foundry partners, and technology development groups, focusing on foundry interface and technology alignment, HSPICE and circuit simulation, test-chip and silicon validation, PDK and design enablement, and AI-enabled productivity improvements. Candidates need a BS, MS, or PhD or equivalent experience in electrical or computer engineering, at least six years of semiconductor industry experience, and hands-on expertise in advanced CMOS, FinFET, HSPICE, device characterization, benchmarking, PPA analysis, and physical verification. The US base salary range is $146,000 to $297,000 per year, with medical, dental, and vision plans available.
