Description
The Principal Process Engineer leads high-level, self-directed technical projects in post-Fab wafer processing, including backgrind, thinning, and metallization, and supports die assembly, testing, reliability, yield learning, defect reduction, and root-cause investigations. The role applies AI-enabled analytics, statistical learning, automation, and predictive insights to improve manufacturing performance, process capability, cycle time, and cost competitiveness, while advising senior management and collaborating across Fab, Assembly, Test, Quality, Equipment, IT, and external suppliers. A bachelor’s degree in engineering or a related discipline is required, along with at least 10 years of relevant semiconductor or academic experience; a postgraduate degree and experience with data analytics or AI tools are advantageous.
