Description
Micron Technology is hiring a Principal Process Engineer in Hybrid and Fusion Die Bonding to lead the startup, development, qualification, and optimization of advanced die-bonding processes for next-generation semiconductor products. The role coordinates process, equipment, and material evaluation; drives yield improvement and cost reduction; validates new processes, tools, and materials; manages supplier quality and risk; supports SPC/FDC/RMS/APC and audits; and collaborates with equipment-development teams and suppliers to enable scalable manufacturing integration.
