Description
Microsoft is hiring a Full-Chip Integration Engineer for its Data Processing Unit (DPU) silicon team. The role owns full-chip and package integration from early design exploration through signoff and tapeout, covering die-size planning, floorplanning, C4 and microbump development, RDL insertion and optimization, power-domain management, power delivery, and package closure. The engineer will collaborate with vendors and cross-functional teams, develop integration methodologies, resolve integration and power-integrity issues, and support chip closure. A bachelor’s degree in computer or electrical engineering and at least seven years of physical design experience focused on C4 integration and chip finishing are required; the position remains open for applications until filled.
