Description
Micron is hiring an Advanced Packaging Characterization Engineer to provide electrical and physical failure analysis for advanced packaging development vehicles, qualifications, customer returns, new product introductions, and test failures. The role establishes characterization and de-processing methods, analyzes hotspots and die-stacked samples using SEM, FIB, TEM, AFM, and related tools, supports process and product engineering teams, maintains the failure-analysis laboratory, and mentors technical staff. Candidates need a PhD with at least five years, a master’s degree with at least seven years, or a bachelor’s degree with at least ten years of relevant experience, along with semiconductor process and failure-analysis expertise.
