Summary from listing
TE Connectivity is hiring a Principal Thermal & Multiphysics Engineer for its Mechanical Center of Excellence to lead advanced thermal research, multiphysics simulation, validation, and thermal architecture for interconnect systems used in AI data centers, high-performance computing, and communication infrastructure. The role develops physics-based FEA/CFD models, optimizes high-power-density systems, supports materials and cooling solutions, validates designs through lab testing, and collaborates with electrical, mechanical, manufacturing, and supplier teams. It requires a bachelor’s degree in mechanical engineering or physics with 12+ years of experience, or equivalent experience, along with expertise in mechanical design and simulation tools such as Creo, SolidWorks, NX, ANSYS, Abaqus, or FloTHERM. The position is remote and offers a base salary of $154,100–$231,100.
